标题： 水平振动基底上水滴的振荡 显示英文标题

标题： Oscillations of a Water Droplet on a Horizontally Vibrating Substrate

摘要： 变形液滴在各种工业应用中很常见，例如喷墨打印、芯片实验室设备和喷雾冷却，并且可能对相关应用产生有利或不利的根本影响。 在这里，我们采用多体耗散粒子动力学来研究水滴在谐波水平振动的固体基底上的振荡。 已经识别出三种不同的振荡情况，作为对基底振动的响应。 第一种情况反映了常见的状况，其中液滴可以跟随基底的振动。 在另外两种情况下，这在亲水基底的情况下更为有利，液滴振荡会产生高的剪切速率，最终导致液滴破裂。 利用我们的模拟模型，以分子级分辨率分析了液滴的性质和与振荡相关的机制，同时结果也从实验的角度进行了探讨。 我们的研究表明，可以通过振荡液滴的接触面速度来区分这三种情况，临界速度受到基底润湿性的影响。 此外，接触面上粒子速度的平均大小在确定三种振荡阶段中起着关键作用，表明振荡液滴的毛细管数决定了相行为。 因此，我们的方法旨在优化固体基底上的液滴振荡和变形，这对技术应用有直接的意义。 显示英文摘要

摘要： Deformed droplets are ubiquitous in various industrial applications, such as inkjet printing, lab-on-a-chip devices, and spray cooling, and can fundamentally affect the involved applications both favorably and unfavorably. Here, we employ many-body dissipative particle dynamics to investigate the oscillations of water droplets on a harmonically and horizontally vibrating, solid substrate. Three distinct scenarios of oscillations as a response to the substrate vibrations have been identified. The first scenario reflects a common situation where the droplet can follow the substrate vibrations. In the other two scenarios, favored in the case of hydrophilic substrates, droplet oscillations generate high shear rates that ultimately lead to droplet breakup. Leveraging our simulation model, the properties of the droplet and the mechanisms related to the oscillations are analyzed with a molecular-level resolution, while results are also put in the perspective of experiment. Our study suggests that the three scenarios can be distinguished by the contact-surface velocity of the oscillating droplet, with threshold velocities influenced by the substrate's wettability. Moreover, the mean magnitude of the particle velocity at the contact surface plays a key role in determining the three oscillation phases, suggesting that the capillary number of the oscillating droplet governs the phase behavior. Thus, our approach aims to optimize droplet oscillations and deformations on solid substrates, which have direct implications for technological applications.