标题： 下一代共封装光学技术在数据中心和其他计算应用中训练和运行生成式AI模型 显示英文标题

标题： Next generation Co-Packaged Optics Technology to Train & Run Generative AI Models in Data Centers and Other Computing Applications

摘要： 我们报告了使用50微米间距的聚合物波导接口成功设计和制造的光学模块，该接口集成用于低损耗、高密度的光学数据传输，并且在硅光子学芯片上所需空间非常小。 该原型模块符合JEDEC可靠性标准，并有望将芯片边缘可连接的光纤数量提高六倍，这一指标称为海滩前沿密度。 将聚合物波导扩展到小于20微米的间距有望使带宽密度提升至10 Tbps/mm以上。 显示英文摘要

摘要： We report on the successful design and fabrication of optical modules using a 50 micron pitch polymer waveguide interface, integrated for low loss, high density optical data transfer with very low space requirements on a Si photonics die. This prototype module meets JEDEC reliability standards and promises to increase the number of optical fibers that can be connected at the edge of a chip, a measure known as beachfront density, by six times compared to state of the art technology. Scalability of the polymer waveguide to less than 20 micron pitch stands to improve the bandwidth density upwards of 10 Tbps/mm.