标题： 氧化硅界面通过电场诱导的水分吸附进行粘附控制 显示英文标题

标题： Adhesion Control through Electric Field-Induced Water Adsorption at Oxidized Silicon Interfaces

摘要： 粘附在计算机芯片制造中起着关键作用，直接影响定位部件（如晶圆台）的精度和耐用性。 电偏置被广泛用于消除浮动电势并实现静电夹紧。 然而，在电气接地后粘附可能仍然存在，关于这种粘附滞后的性质了解有限。 在此，我们使用原子力显微镜研究了在n型AFM探针和p型硅样品之间的界面处电场引起的粘附滞后的潜在原因。 我们的研究结果表明，电荷捕获或硅氧烷键形成对测量的粘附影响不大。 令人惊讶的是，我们在低相对湿度（RH < 10%）条件下通过电场诱导的水吸附展示了可以调节粘附。 我们的结果为粘附滞后的理解提供了新见解，并为粘附控制提供了机会。 显示英文摘要

摘要： Adhesion plays a pivotal role in computer chip manufacturing, directly affecting the precision and durability of positioning components such as wafer stages. Electrical biasing is widely employed to eliminate floating potential and to enable electrostatic clamping. However, upon electrical grounding adhesion can persist and there is limited knowledge about the nature of this adhesion hysteresis. Here, we investigate potential causes underlying electric field-induced adhesion hysteresis at the interface between an n-type AFM tip and a p-type silicon sample using atomic force microscopy. Our findings reveal that neither charge trapping nor siloxane bond formation significantly impacts the measured adhesion. Surprisingly, we show that adhesion can be tuned through electric field-induced water adsorption under low relative humidity (RH < 10%). Our results provide new insights into adhesion hysteresis and opportunities for adhesion control.