标题： 探索纳米尺度金属多层Ta/Cu薄膜：结构以及关于变形和强化机制的一些见解 显示英文标题

标题： Exploring nanoscale metallic multilayer Ta/Cu films: Structure and some insights on deformation and strengthening mechanisms

摘要： 纳米尺度金属多层（NMM）薄膜是提供关于界面在金属塑性、变形和强化机制中作用的系统。 使用磁控溅射法制备了周期性（Ta和Cu层厚度相等）从6到80 nm的Ta-Cu NMM薄膜，所得结构表现出强非共格四四方晶系β-Ta和面心立方Cu相。 高载荷压痕试验、透射电镜研究和rCLS模型共同表明，所有NMM薄膜主要发生塑性变形。 这种塑性变形主要发生在柔软的Cu层中，而位错穿过非共格界面的传播则被很大程度地排除。 显示英文摘要

摘要： Nanoscale metallic multilayer (NMM) films are systems offering insight into the role of interfaces in metal plasticity, deformation, and strengthening mechanisms. Magnetron sputtering was used to fabricate the Ta-Cu NMM films with a periodicity (equal Ta and Cu layer thickness) from 6 to 80 nm, with resulting structure exhibiting strongly incoherent tetragonal beta-Ta and face-centered cubic Cu phase. The high-load indentation test, TEM studies, and the rCLS model collectively demonstrate that all NMM films predominantly undergo plastic deformation. This plastic deformation primarily occurs within the soft Cu layer, while the propagation of dislocations across the incoherent interface is largely excluded.