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arXiv:1908.06620 (physics)
[Submitted on 19 Aug 2019 (v1) , last revised 8 Nov 2019 (this version, v2)]

Title: Electron-phonon coupling and hot electron thermalization in titanium nitride

Title: 钛氮化物中的电子-声子耦合和热电子弛豫

Authors:Stefano Dal Forno, Johannes Lischner
Abstract: We have studied the thermalization of hot carriers in both pristine and defective titanium nitride (TiN) using a two-temperature model. All parameters of this model, including the electron-phonon coupling parameter, were obtained from first-principles density-functional theory calculations. The virtual crystal approximation was used to describe defective systems. We find that thermalization of hot carriers occurs on much faster time scales than in gold as a consequence of the significantly stronger electron-phonon coupling in TiN. Specifically, the largest thermalization times, on the order of 200 femtoseconds, are found in TiN with nitrogen vacancies for electron temperatures around 4000 K.
Abstract: 我们使用双温度模型研究了纯钛氮化物(TiN)和缺陷钛氮化物中热载流子的热化过程。 该模型的所有参数,包括电子-声子耦合参数,均来自第一性原理密度泛函理论计算。 虚拟晶体近似用于描述缺陷体系。 我们发现,由于TiN中电子-声子耦合显著增强,热载流子的热化发生在比金快得多的时间尺度上。 具体而言,在氮空位的TiN中,电子温度约为4000 K时,最大的热化时间在200飞秒量级。
Comments: 22 pages, 6 figures
Subjects: Computational Physics (physics.comp-ph) ; Materials Science (cond-mat.mtrl-sci)
Cite as: arXiv:1908.06620 [physics.comp-ph]
  (or arXiv:1908.06620v2 [physics.comp-ph] for this version)
  https://doi.org/10.48550/arXiv.1908.06620
arXiv-issued DOI via DataCite
Journal reference: Phys. Rev. Materials 3, 115203 (2019)
Related DOI: https://doi.org/10.1103/PhysRevMaterials.3.115203
DOI(s) linking to related resources

Submission history

From: Stefano Dal Forno [view email]
[v1] Mon, 19 Aug 2019 07:24:36 UTC (455 KB)
[v2] Fri, 8 Nov 2019 06:34:52 UTC (1,704 KB)
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