标题： 专用集成电路（ASIC）中用于硬X射线成像探测器的硅通孔（TSV）的概念验证 显示英文标题

标题： Proof of Concept for Through Silicon Vias (TSVs) in Application Specific Integrated Circuits (ASICs) for Hard X-ray Imaging Detectors

摘要： 专用集成电路（ASIC）常用于高效处理来自太空传感器和探测器的信号。引线键合是一种经过空间认证的技术，用于在ASIC与其基板封装板之间建立电源、控制和读出连接。引线键合在现代航天项目中几乎无处不在，但其裸露的引线在组装过程中容易受损，并且在运行期间可能受到电干扰。此外，为了实现引线键合而需要的额外空间也阻碍了大型探测器阵列的高效封装。 本文介绍了替代引线键合的硅穿孔（TSV）技术，并消除了传统方法的缺点。我们已经成功展示了在现有ASIC晶圆（即后通孔工艺）上实施TSV的可行性，这些晶圆是为核频谱望远镜阵列（NuSTAR）小型探索者任务中处理X射线成像CdZnTe探测器的X射线信号而开发的。虽然TSV在半导体行业中很常见，但我们认为这是首次（据我们所知）在天体物理学成像仪器上的成功应用。我们预计TSV技术将简化探测器的组装过程，从而显著节省大面积CdZnTe探测器组装的成本和时间。 显示英文摘要

摘要： Application Specific Integrated Circuits (ASICs) are commonly used to efficiently process the signals from sensors and detectors in space. Wire bonding is a space qualified technique of making interconnections between ASICs and their substrate packaging board for power, control and readout of the ASICs. Wire bonding is nearly ubiquitous in modern space programs, but their exposed wires can be prone to damage during assembly and subject to electric interference during operations. Additional space around the ASICs needed for wire bonding also impedes efficient packaging of large arrays of detectors. Here we introduce the Through Silicon Vias (TSV) technology that replaces wire bonds and eliminates their shortcomings. We have successfully demonstrated the feasibility of implementing TSVs to existing ASIC wafers (a.k.a. a via-last process) developed for processing the X-ray signals from the X-ray imaging CdZnTe detectors on the Nuclear Spectroscopic Telescope Array (NuSTAR) Small Explorer mission that was launched in 2012. While TSVs are common in the semiconductor industry, this is the first (to our knowledge) successful application for Astrophysics imaging instrumentation. We expect that the TSV technology will simplify the detector assembly, and thus will enable significant cost and schedule savings in assembly of large area CdZnTe detectors.