标题： 光子集成电路分组件测试的激光写入现象显微表征 显示英文标题

标题： Microscopic characterisation of laser-written phenomena for component-wise testing of photonic integrated circuits

摘要： 基于飞秒激光直接写入的光子集成电路（PICs）在量子信息处理（QIP）等多个领域展现出巨大潜力。 许多应用，如基于光子的量子计算，要求PICs的规模扩大和越来越高的光学性能，例如可控制的偏振依赖性和更低的损耗。 为了克服当前在制造精度、重复性和材料均匀性方面的限制，需要一种以组件方式对大规模PIC进行无损测试的解决方案，以满足这些日益严格的要求。 在此，我们展示了一种通过基于自适应光学三次谐波生成（THG）三维（3D）显微镜成像预测PIC组件性能的无损组件方式测试解决方案。 3D THG成像可以在多组件PIC中的任何组件或其部分上进行。 此外，通过发现新现象，我们还证明了3D THG显微镜为研究透明材料中光-物质相互作用的基本原理提供了一条新途径。 显示英文摘要

摘要： Photonic integrated circuits (PICs) directly written with a femtosecond laser have shown great potential in many areas such as quantum information processing (QIP). Many applications, like photon-based quantum computing, demand the up-scaling of PICs and ever-higher optical performance, such as controllable polarisation dependence and lower loss. In order to overcome current limitations in fabrication precision, repeatability and material uniformity, a solution for non-destructive testing of large-scale PICs in a component-wise manner is desired to meet those ever-stricter demands. Here we demonstrate a solution for non-destructive component-wise testing by predicting the performance of a PIC component based on imaging with an adaptive optical third-harmonic-generation (THG) three-dimensional (3D) microscope. The 3D THG imaging can be performed on any component or part of it inside multi-component PIC. Moreover, through discovering new phenomena we also demonstrated that 3D THG microscopy provides a new pathway towards studying the fundamentals of light-matter interaction in transparent materials.