标题： 半导体中超快激光能量沉积导致细丝化的普遍性挑战 显示英文标题

标题： The universality of filamentation-caused challenges of ultrafast laser energy deposition in semiconductors

摘要： 半导体中的光传播是新兴颠覆性技术的基础，这些技术具有革命化电信、传感器、量子工程、医疗保健和人工智能的巨大潜力。 这些材料的超高光学非线性使其成为光电集成电路的理想平台。 这种复杂器件的制造可以从体积内超快激光书写中大大受益，用于单片和无接触集成。 然而，正如硅所例证的那样，非线性作用就像一个高效的免疫系统，自我保护材料免受超短激光脉冲可能产生的内部永久性修改。 虽然高能高强度超短激光脉冲在硅中的非线性传播已被广泛研究，但其他半导体仍尚未被探索。 在这项工作中，我们证明了丝化普遍决定了各种半导体中超短激光脉冲的传播。 获得的有效关键非线性参数与使用低强度脉冲的标准测量结果有很大不同。 此外，提取了这些关键参数的时间标度定律。 最后，提出了时间-频谱整形以优化半导体内的能量沉积。 这一整套结果为未来的改进奠定了基础，直到半导体可以通过超快激光书写进行选择性内部定制，从而导致芯片内处理和功能化的无数应用，并在包括科技、光子学和半导体在内的各个领域开辟新市场。 显示英文摘要

摘要： Light propagation in semiconductors is the cornerstone of emerging disruptive technologies holding considerable potential to revolutionize telecommunications, sensors, quantum engineering, healthcare, and artificial intelligence. Sky-high optical nonlinearities make these materials ideal platforms for photonic integrated circuits. The fabrication of such complex devices could greatly benefit from in-volume ultrafast laser writing for monolithic and contactless integration. Ironically, as exemplified for Si, nonlinearities act as an efficient immune system self-protecting the material from internal permanent modifications that ultrashort laser pulses could potentially produce. While nonlinear propagation of high-intensity ultrashort laser pulses has been extensively investigated in Si, other semiconductors remain uncharted. In this work, we demonstrate that filamentation universally dictates ultrashort laser pulse propagation in various semiconductors. The effective key nonlinear parameters obtained strongly differ from standard measurements with low-intensity pulses. Furthermore, the temporal scaling laws for these key parameters are extracted. Temporal-spectral shaping is finally proposed to optimize energy deposition inside semiconductors. The whole set of results lays the foundations for future improvements, up to the point where semiconductors can be selectively tailored internally by ultrafast laser writing, thus leading to countless applications for in-chip processing and functionalization, and opening new markets in various sectors including technology, photonics, and semiconductors.